Superior Thermal Management
- Solid metal pad enables more efficient heat dissipation than standard BGA packages.
- Thermal resistance is generally 25% lower than the standard BGA, achieving 5 to 6W heat dissipation under regular operation
Excellent Signal Integrity
- Built-in circuitry and embedded copper pillars support high-speed, high-frequency performance with minimal resistance.
Exceptional Reliability
- Molded body delivers greater resistance to thermal cycling and mechanical stress.