pillarSUBSTRATE


Key Features of pillarSubstrate

 


Packaging Substrate Structure Comparison 

 


Key Advantages of pillarSubstrate

  • Superior Thermal Management 

       - Solid metal pad enables more efficient heat dissipation than standard BGA packages.

- Thermal resistance is generally 25% lower than the standard BGA, achieving 5 to 6W heat dissipation under regular operation

  • Excellent Signal Integrity

- Built-in circuitry and embedded copper pillars support high-speed, high-frequency performance with minimal resistance.

  • Exceptional Reliability

- Molded body delivers greater resistance to thermal cycling and mechanical stress.

 


pillarSUBSTRATE LineUp 

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