The key benefit of Bridge’s multi-row lead frame is to support array assembly with high throughput and high reliability. Much like a conventional laminate substrate, its array terminals can help devices to meet stringent form-factor requirements and yet enjoy superior thermal & electrical benefits like QFN.

Key Features

• Controlled flatness at strip-level
• Devoid of resin crack
• Multiple surface finishings for wire bonding
• Pre-treated Cu surface for enhanced resin/Cu interface