This product is developed to support the power module assembly where both heat dissipation and circuitry routing are essential. The key feature of the substrate is the embedding of multiple copper studs in a conventional laminate so that the modules' mechanical, thermal, and electrical performances can be enhanced.

Key Benefits

• Naturally flat and mechanically robust

• Great flexibility for routing, including the power and ground placement

• Adopt PCB/Substrate manufacturing infrastructures

APPLICATIONS

GENERAL DESIGN GUIDELINES