Concept of Embedded Metal Substrate (EMS)

Multiple metal blocks are implanted in a resin core, and form effective thermal or current channels.

Key Features of Embedded Metal Substrate(EMS)

• Substrate-based multi-layer routing facilitates flexible module design

• Embedded metal studs enable high current/high heat dissipation

• Allows flip-chip / SMD assembling

Example of EMS

Schematic Flow for Embedded Die Substrate (EDS)  

Key Advantage of Embedded Die Substrate (EDS)

• Molded Lead Frame Provides Basic Support

• Die-in-Cavity can Avoid Chip Displacement

• Double-Sided RDL Minimize Warpage

• Cost Competitiveness

Cavity Substrate Specification

Chip Placement and Pad Specifications

RDL Layer Disposition  (Double-Sided)

RDL Layer and Dielectric Specifications

Embedded  Power Module Assembly 

Molded Lead Frame

Molded Lead Frame with Cavities

Molded Lead Frame with Build-Up Circuitry