This lead frame substrate is designed to support module assemblies where both thermal and electrical characteristics are essential. The routing layer on top of the QFN lead frame allows for flexible layout whereas exposed die paddle allows for chip directly contacts on the thermal pad.

Key Benefits

• No PTH

• Flat and Robust

• Fine-line routing

• Build-in wettable flank feature

• Accommodate FC/WB/SMT

• One piece of metal ensures high reliability

APPLICATION EXAMPLE

SiP Module Assembling

GENERAL GUIDELINES