Fan-Out Panel Level Packaging


 

 

A cool and powerful architecture that allows lower profile, cost and Rth.

 


Schematic Process Flow

Primary Routing Circuitry

 

 

Flip Chip Assembly

 

 

Underfill

 

 

Heat spreader attachment 

 

 

Molding

 

 

De-bond Carrier

 

 

Singulation

 

 

Panel Opening

 

 

Adhesive Tape Attachment

 

 

Device Placement

 

 

Secondary Routing Circuitry

 

 

Adhesive Tape Removal

 

 

 

 

聯絡我們留言