Fineline Substrate


 

A packaging substrate that integrates thin film with laminate build-up provides a platform

for chip-last assembly with the benefits of high reliability and competitive cost.

 


 

Schematic Process Flow

Primary Routing Circuitries

 

 

Stiffener Attachement

 

 

Secondary Routing Circuitries 

 

 

Carrier Removal

 

 

Fineline Substrate with Flatness Controller

 

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