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U.S. Patent Portfolio
U.S. Patent Portfolio
U.S. Patent Portfolio
PAT. NO.
Title
1
10,804,205
Interconnect substrate with stiffener and warp balancer and semiconductor assembly using the same
2
10,546,808
Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assembly
3
10,446,526
Face-to-face semiconductor assembly having semiconductor device in dielectric recess
4
10,420,204
Wiring board having electrical isolator and moisture inhibiting cap incorporated therein and method of making the same
5
10,361,151
Wiring board having isolator and bridging element and method of making wiring board
6
10,354,984
Semiconductor assembly with electromagnetic shielding and thermally enhanced characteristics and method of making the same
7
10,306,777
Wiring board with dual stiffeners and dual routing circuitries integrated together and method of making the same
8
10,269,722
Wiring board having component integrated with leadframe and method of making the same
9
10,242,964
Wiring substrate for stackable semiconductor assembly and stackable semiconductor assembly using the same
10
10,217,710
Wiring board with embedded component and integrated stiffener, method of making the same and face-to-face semiconductor assembly using the same
11
10,211,067
Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assembly
12
10,199,321
Interconnect substrate having cavity for stackable semiconductor assembly, manufacturing method thereof and vertically stacked semiconductor assembly using the same
13
10,177,130
Semiconductor assembly having anti-warping controller and vertical connecting element in stiffener
14
10,177,090
Package-on-package semiconductor assembly having bottom device confined by dielectric recess
15
10,134,711
Thermally enhanced semiconductor assembly with three dimensional integration and method of making the same
16
10,121,768
Thermally enhanced face-to-face semiconductor assembly with built-in heat spreader and method of making the same
17
10,096,573
Face-to-face semiconductor assembly having semiconductor device in dielectric recess
18
10,062,663
Semiconductor assembly with built-in stiffener and integrated dual routing circuitries and method of making the same
19
9,947,625
Wiring board with embedded component and integrated stiffener and method of making the same
20
9,913,385
Methods of making stackable wiring board having electronic component in dielectric recess
21
9,825,009
Interconnect substrate having cavity for stackable semiconductor assembly, manufacturing method thereof and vertically stacked semiconductor assembly using the same
22
9,640,518
Semiconductor package with package-on-package stacking capability and method of manufacturing the same
23
9,570,372
Thermally enhanced semiconductor assembly with heat spreader and integrated dual build-up circuitries and method of making the same
24
9,349,711
Semiconductor device with face-to-face chips on interposer and method of manufacturing the same
25
9,299,651
Semiconductor assembly and method of manufacturing the same
26
9,230,901
Semiconductor device having chip embedded in heat spreader and electrically connected to interposer and method of manufacturing the same
27
9,209,154
Semiconductor package with package-on-package stacking capability and method of manufacturing the same
28
9,147,667
Semiconductor device with face-to-face chips on interposer and method of manufacturing the same
29
9,147,587
Interconnect substrate with embedded semiconductor device and built-in stopper and method of making the same
30
9,087,847
Thermally enhanced interconnect substrate with embedded semiconductor device and built-in stopper and method of making the same
31
9,064,878
Wiring board with shielding lid and shielding slots as electromagnetic shields for embedded device
32
9,018,667
Semiconductor chip assembly with post/base heat spreader and dual adhesives
33
8,952,526
Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
34
8,927,339
Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry
35
8,901,435
Hybrid wiring board with built-in stopper, interposer and build-up circuitry
36
8,895,380
Method of making semiconductor assembly with built-in stiffener and semiconductor assembly manufactured thereby
37
8,865,525
Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby
38
8,841,171
Method of making stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
39
8,614,502
Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic device
40
8,535,985
Method of making a semiconductor chip assembly with a bump/base heat spreader and an inverted cavity in the bump
41
8,531,024
Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace
42
8,525,214
Semiconductor chip assembly with post/base heat spreader with thermal via
43
8,415,703
Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange
44
8,378,372
Semiconductor chip assembly with post/base heat spreader and horizontal signal routing
45
8,354,688
Semiconductor chip assembly with bump/base/ledge heat spreader, dual adhesives and cavity in bump
46
8,354,283
Method of making a semiconductor chip assembly with a bump/base/ledge heat spreader, dual adhesives and a cavity in the bump
47
8,343,808
Method of making stackable semiconductor assembly with bump/base/flange heat spreader and build-up circuitry
48
8,329,510
Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer
49
8,324,723
Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump
50
8,324,653
Semiconductor chip assembly with ceramic/metal substrate
51
8,314,438
Semiconductor chip assembly with bump/base heat spreader and cavity in bump
52
8,310,043
Semiconductor chip assembly with post/base heat spreader with ESD protection layer
53
8,304,292
Method of making a semiconductor chip assembly with a ceramic/metal substrate
54
8,298,868
Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-hole
55
8,288,792
Semiconductor chip assembly with post/base/post heat spreader
56
8,283,211
Method of making a semiconductor chip assembly with a bump/base heat spreader and a dual-angle cavity in the bump
57
8,269,336
Semiconductor chip assembly with post/base heat spreader and signal post
58
8,241,962
Method of making a semiconductor chip assembly with a post/base heat spreader, a signal post and a cavity
59
8,236,619
Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace
60
8,236,618
Method of making a semiconductor chip assembly with a post/base/post heat spreader
61
8,232,576
Semiconductor chip assembly with post/base heat spreader and ceramic block in post
62
8,232,573
Semiconductor chip assembly with aluminum post/base heat spreader and silver/copper conductive trace
63
8,227,270
Method of making a semiconductor chip assembly with a post/base heat spreader and an adhesive between the base and a terminal
64
8,212,279
Semiconductor chip assembly with post/base heat spreader, signal post and cavity
65
8,207,553
Semiconductor chip assembly with base heat spreader and cavity in base
66
8,207,019
Method of making a semiconductor chip assembly with a post/base/post heat spreader and asymmetric posts
67
8,203,167
Semiconductor chip assembly with post/base heat spreader and adhesive between base and terminal
68
8,193,556
Semiconductor chip assembly with post/base heat spreader and cavity in post
69
8,178,395
Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal via
70
8,163,603
Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding
71
8,153,477
Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader
72
8,148,747
Semiconductor chip assembly with post/base/cap heat spreader
73
8,148,207
Method of making a semiconductor chip assembly with a post/base/cap heat spreader
74
8,129,742
Semiconductor chip assembly with post/base heat spreader and plated through-hole
75
8,110,446
Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace
76
8,076,182
Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post
77
8,067,784
Semiconductor chip assembly with post/base heat spreader and substrate
78
8,067,270
Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate
79
8,062,912
Method of making a semiconductor chip assembly with a post/base heat spreader and horizontal signal routing
80
8,034,645
Method of making a semiconductor chip assembly with a copper/aluminum post/base heat spreader
81
8,003,416
Method of making a semiconductor chip assembly with a post/base heat spreader and dual adhesives
82
8,003,415
Method of making a semiconductor chip assembly with a post/base heat spreader and vertical signal routing
83
7,993,983
Method of making a semiconductor chip assembly with chip and encapsulant grinding
84
7,951,622
Method of making a semiconductor chip assembly with a post/base heat spreader and a signal post
85
7,948,076
Semiconductor chip assembly with post/base heat spreader and vertical signal routing
86
7,939,375
Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post
87
7,932,165
Method of making a semiconductor chip assembly with a laterally aligned filler and insulative base
88
7,901,993
Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive trace
89
7,833,827
Method of making a semiconductor chip assembly with a bumped terminal, a filler and an insulative base
90
7,811,863
Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachment
91
7,750,483
Semiconductor chip assembly with welded metal pillar and enlarged plated contact terminal
92
7,656,031
Stackable semiconductor package having metal pin within through hole of package
93
7,538,415
Semiconductor chip assembly with bumped terminal, filler and insulative base
94
7,494,843
Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding
95
7,459,385
Method of making a semiconductor chip assembly with a laterally aligned bumped terminal and filler
96
7,453,140
Semiconductor chip assembly with laterally aligned filler and insulative base
97
7,446,419
Semiconductor chip assembly with welded metal pillar of stacked metal balls
98
7,425,759
Semiconductor chip assembly with bumped terminal and filler
99
7,419,851
Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal
100
7,417,314
Semiconductor chip assembly with laterally aligned bumped terminal and filler
101
7,414,319
Semiconductor chip assembly with metal containment wall and solder terminal
102
7,396,703
Method of making a semiconductor chip assembly with a bumped terminal and a filler
103
7,319,265
Semiconductor chip assembly with precision-formed metal pillar
104
7,268,421
Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond
105
7,264,991
Method of connecting a conductive trace to a semiconductor chip using conductive adhesive
106
7,262,082
Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture
107
7,245,023
Semiconductor chip assembly with solder-attached ground plane
108
7,232,707
Method of making a semiconductor chip assembly with an interlocked contact terminal
109
7,232,706
Method of making a semiconductor chip assembly with a precision-formed metal pillar
110
7,229,853
Method of making a semiconductor chip assembly using multiple etch steps to form a pillar after forming a routing line
111
7,227,249
Three-dimensional stacked semiconductor package with chips on opposite sides of lead
112
7,215,019
Semiconductor chip assembly with pillar press-fit into ground plane
113
7,192,803
Method of making a semiconductor chip assembly with simultaneously formed interconnect and connection joint
114
7,190,080
Semiconductor chip assembly with embedded metal pillar
115
7,190,060
Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same
116
7,157,791
Semiconductor chip assembly with press-fit ground plane
117
7,148,082
Method of making a semiconductor chip assembly with a press-fit ground plane
118
7,132,741
Semiconductor chip assembly with carved bumped terminal
119
7,129,575
Semiconductor chip assembly with bumped metal pillar
120
7,129,113
Method of making a three-dimensional stacked semiconductor package with a metal pillar in an encapsulant aperture
121
7,112,521
Method of making a semiconductor chip assembly with a bumped metal pillar
122
7,094,676
Semiconductor chip assembly with embedded metal pillar
123
7,087,466
Method of making a semiconductor chip assembly with a solder-attached ground plane
124
7,075,186
Semiconductor chip assembly with interlocked contact terminal
125
7,071,573
Semiconductor chip assembly with welded metal pillar
126
7,071,089
Method of making a semiconductor chip assembly with a carved bumped terminal
127
7,067,911
Three-dimensional stacked semiconductor package with metal pillar in encapsulant aperture
128
7,064,012
Method of making a semiconductor chip assembly with a pillar and a routing line using multiple etch steps
129
7,015,128
Method of making a semiconductor chip assembly with an embedded metal particle
130
7,009,309
Semiconductor package device that includes an insulative housing with a protruding peripheral portion
131
7,009,297
Semiconductor chip assembly with embedded metal particle
132
6,989,584
Semiconductor package device that includes a conductive trace with a routing line, a terminal and a lead
133
6,989,295
Method of making a semiconductor package device that includes an insulative housing with first and second housing portions
134
6,987,034
Method of making a semiconductor package device that includes singulating and trimming a lead
135
6,984,576
Method of connecting an additively and subtractively formed conductive trace and an insulative base to a semiconductor chip
136
6,949,408
Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps
137
6,936,495
Method of making an optoelectronic semiconductor package device
138
6,908,794
Method of making a semiconductor package device that includes a conductive trace with recessed and non-recessed portions
139
6,908,788
Method of connecting a conductive trace to a semiconductor chip using a metal base
140
6,891,276
Semiconductor package device
141
6,876,072
Semiconductor chip assembly with chip in substrate cavity
142
6,872,591
Method of making a semiconductor chip assembly with a conductive trace and a substrate
143
6,846,735
Compliant test probe with jagged contact surface
144
6,809,414
Semiconductor chip assembly with bumped conductive trace
145
6,803,651
Optoelectronic semiconductor package device
146
6,800,506
Method of making a bumped terminal in a laminated structure for a semiconductor chip assembly
147
6,794,741
Three-dimensional stacked semiconductor package with pillars in pillar cavities
148
6,774,659
Method of testing a semiconductor package device
149
6,744,126
Multichip semiconductor package device
150
6,740,576
Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly
151
6,716,670
Method of forming a three-dimensional stacked semiconductor package device
152
6,699,780
Method of connecting a conductive trace to a semiconductor chip using plasma undercut etching
153
6,673,710
Method of connecting a conductive trace and an insulative base to a semiconductor chip
154
6,667,229
Method of connecting a bumped compliant conductive trace and an insulative base to a semiconductor chip
155
6,608,374
Semiconductor chip assembly with bumped conductive trace
156
6,593,224
Method of manufacturing a multilayer interconnect substrate
157
6,583,040
Method of making a pillar in a laminated structure for a semiconductor chip assembly
158
6,576,493
Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps
159
6,537,851
Method of connecting a bumped compliant conductive trace to a semiconductor chip
160
6,492,252
Method of connecting a bumped conductive trace to a semiconductor chip
161
6,486,549
Semiconductor module with encapsulant base
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