CORELESS SUBSTRATE (with compartment shielding)


(with compartment shielding)

 

Laminating buildup layers with thermally conductive dielectric material create a coreless substrate with superior thermal and electrical benefits.

 


KEY FEATURES

  • Thermally conductive dielectric material allows heat generated by chip can be dissipated effectively

  • Largely resolve chip hot-spot concern, and for certain devices, extra thermal solution may not be necessary

  • Coreless structure enables low latency and low loss requirements

  • Thin in thickness and low in warpage

 


LAYOUT GUIDELINES

 


 

SCHEMATIC ASSEMBLY

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