(with compartment shielding)
Laminating buildup layers with thermally conductive dielectric material create a coreless substrate with superior thermal and electrical benefits.
Thermally conductive dielectric material allows heat generated by chip can be dissipated effectively
Largely resolve chip hot-spot concern, and for certain devices, extra thermal solution may not be necessary
Coreless structure enables low latency and low loss requirements
Thin in thickness and low in warpage