(with compartment shielding)

Laminating buildup layers with thermally conductive dielectric material create a coreless substrate with superior thermal and electrical benefits.

KEY FEATURES

• Thermally conductive dielectric material allows heat generated by chip can be dissipated effectively

• Largely resolve chip hot-spot concern, and for certain devices, extra thermal solution may not be necessary

• Coreless structure enables low latency and low loss requirements

• Thin in thickness and low in warpage

LAYOUT GUIDELINES

SCHEMATIC ASSEMBLY