Pre-Molded Lead Frame


This product is specifically designed to support the air-dielectric assembly of a high-frequency, high-power device. The key feature of the frame is the modulated resin/metal interface, which in turn provides a mechanically robust, gross-leakage-free substrate for lidded, near-hermetic RF power module assemblies.


Key Features

  • Designed for Air-Cavity Package

  • Gross leakage-free (after reflow)

  • Adapt wettable flank feature

  • Thick copper base


 Air-Dielectric Assembly Example

 

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