This product is specifically designed to support the air-dielectric assembly of a high-frequency, high-power device. The key feature of the frame is the modulated resin/metal interface, which in turn provides a mechanically robust, gross-leakage-free substrate for lidded, near-hermetic RF power module assemblies.

Key Features

• Designed for Air-Cavity Package

• Gross leakage-free (after reflow)

• Adapt wettable flank feature

• Thick copper base

 Air-Dielectric Assembly Example