Key Features of pillarSubstrate

Packaging Substrate Structure Comparison 

Key Advantages of pillarSubstrate

• Superior Thermal Management 

       - Solid metal pad enables more efficient heat dissipation than standard BGA packages.

- Thermal resistance is generally 25% lower than the standard BGA, achieving 5 to 6W heat dissipation under regular operation

• Excellent Signal Integrity

- Built-in circuitry and embedded copper pillars support high-speed, high-frequency performance with minimal resistance.

• Exceptional Reliability

- Molded body delivers greater resistance to thermal cycling and mechanical stress.

pillarSUBSTRATE LineUp