This product is specifically designed to support the air-dielectric assembly of a high-frequency, high-power device. The key feature of the frame is the modulated resin/metal interface, which in turn provides a mechanically robust, gross-leakage-free substrate for lidded, near-hermetic RF power module assemblies.
Designed for Air-Cavity Package
Gross leakage-free (after reflow)
Adapt wettable flank feature
Thick copper base