ROUTABLE LEADFRAME


Low Dk/Df dielectrics circuitries deposited on lead frame with exposed metal pad aims to provide both thermal and design flexibility benefits for SiP applications. 

 


KEY FEATURES

  • Buildup layer enables freedom in circuitry routing

  • Low Dk/Df dielectrics for low latency and loss

  • Robust power delivery to support high bandwidth

  • Heat dissipation much like QFN

 


LAYOUT GUIDELINES

 


 

SCHEMATIC ASSEMBLY

 

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