Pre-Coated Lead Frame


The resin pre-coated in a metal framework offers an ideal alternative to the laminate substrate in a wire-bonding BGA assembly where both electrical/ thermal characteristics and package reliability can be significantly improved. Further, this lead frame can support the molded package with a solderability indicator during AOI inspection after board assembly. This indicator is realized through a wettable flank built in the lead frame and, at the same time, provides an enhanced solder joint between the component and board.