Routable Lead Frame (Selective Dielectrics)


KEY FEATURES

  • Build-up layer enables freedom in circuitry routing

  • Multi-row allows higher lead count package

  • Low Dk/Df dielectrics for low latency and loss

  • Robust power delivery to support high bandwidth

  • Heat dissipation much like QFN

 


 

Build-up circuitries on lead frame with exposed metal pad enables both electrical and thermal benefits. 

 


LAYOUT GUIDELINES

 


DEVICE ASSEMBLY (1)

 


DEVICE ASSEMBLY (2)

 

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