Pre-Coated Lead Frame


        

The resin pre-coated in a metal framework offers an ideal alternative to the laminate substrate in a wire-bonding BGA assembly where both electrical/ thermal characteristics and package reliability can be significantly improved. Further, this lead frame can support the molded package with a solderability indicator during AOI inspection after board assembly. This indicator is realized through a wettable flank built in the lead frame and, at the same time, provides an enhanced solder joint between the component and board.

 


GENERAL GUIDELINES

 

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