Multi-Row Lead Frame


The key benefit of Bridge’s multi-row lead frame is leveraging conventional back-end manufacturing technology to support Array QFN assembly with high throughput and high reliability. Compared to standard QFN, the smaller footprint of Array QFN can meet high-density interconnect requirements. It also enables superior thermal & electrical characteristics for devices, thus suitable for high-power and high-frequency applications.

Key Features

  • Controlled flatness at strip-level
  • Devoid of resin crack
  • Multiple surface finishings for wire bonding
  • Pre-treated Cu surface for enhanced resin/Cu interface