powerSubstrate


This product is developed to support the power module assembly where heat dissipation and circuitry routing capability are essential. The key feature of the substrate is the multiple metal studs embedded in a conventional laminate so that mechanical, thermal, and electrical performances can be significantly enhanced. 

 


Key Benefits

  • Naturally flat and mechanically robust
  • Adopt PCB/Substrate manufacturing infrastructures
  • Facilitate multi-chip, higher pin-count, passive integration, as well as flexibility for power and ground placement

   

 


APPLICATIONS

  

    

             

   


GENERAL DESIGN GUIDELINES

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