Metal Cavity Substrate


KEY FEATURES

Integrating cavity and routing circuitry onto solid metal provides superior design flexibility and long-term reliability for power device and laser packaging

 


 

 

  • Top metal cap designed for external cooling pathway (air or liquid)

  • Sidewall metal to ensure EMI coverage

  • Resin-defined cavity aims for self-aligned die placement

  • Built-in circuitry to enhance routing flexibility for multi-die integration

  • Panel format allows for PCB processing

  • Ease of use, minimal assembly processes

 


SCHEMATIC ASSEMBLY EXAMPLE 

 

 

Multi-Die Assembly Key Merits

  • Excellent thermal characteristics

  • Low parasitics and inductance

  • Superior EMI shielding

  • Mechanically robust and reliable

 


RELIABILITY DATA

 

 

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