Hybrid Substrate


Hybrid
(Ceramic/Laminate)

KEY FEATURES

Matching CTE for chip and PCB, and excellent heat spreading thru ceramic

 


 


W/B ASSEMBLY

 


CERAMIC SPECIFICATION

 


LAYOUT GUIDELINES

 


 

Hybrid
(Ceramic/Lead Frame)

CLASSIFICATION

Wire Bond Type

 

 

Flip Chip Type

 

 

 

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