Thermally Enhanced Substrates Structure Comparison 

Designed for Modules with Superior Thermal Management

Key Benefits

• Routing flexibility enables a high degree of freedom in module design

• Integral copper base structure ensures optimal thermal performance

• Lower chip operation temperature and PTH-free offer high package-level  reliability

Competitive Advantages

• The highest possible thermal performance for resin-based module

• Flexible routing enables a high degree of freedom in module design

Addressable Markets: Auto /Robot and RF 

• Our Competitiveness

- Highest thermal and reliability among all plastic BGA and modules

- Best cost/performance

• Applications for:

- Engine Control Unit

- Transmission Control Unit

- Sensing / Monitoring

- RF communication