ROUTABLE LEAD FRAME (GLOBAL DIELECTRICS)


 

Enable semiconductor devices with higher performance, lower power consumption, and better thermal management

 


KEY FEATURES

  • Large panel manufacturing on metal carrier

  • Truly chip-last assembly without de-panel process

  • No extra substrate needed

  • Designed for the integration of microprocessor, sensors, RF, automotive, and power devices

 


SCHEMATIC ASSEMBLY

 

 

 


LAYOUT GUIDELINES

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