Molded Metal Substrate


Thermally Enhanced Substrates Structure Comparison 

 


Designed for Modules with Superior Thermal Management

 

Key Benefits

  • Routing flexibility enables a high degree of freedom in module design

  • Integral copper base structure ensures optimal thermal performance

  • Lower chip operation temperature and PTH-free offer high package-level  reliability

              


Competitive Advantages

  • The highest possible thermal performance for resin-based module

  • Flexible routing enables a high degree of freedom in module design

 


Addressable Markets: Auto /Robot and RF 

  • Our Competitiveness

- Highest thermal and reliability among all plastic BGA and modules

- Best cost/performance

  • Applications for:

- Engine Control Unit

- Transmission Control Unit

- Sensing / Monitoring

- RF communication

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