This lead frame substrate is designed to support the SiP assembly where the thermal characteristic is essential. Further, due to the advantage of the PTH-free nature of the metal post terminal, this substrate enables a high current carrying feature that the conventional laminate substrate is difficult to achieve.
No PTH
Flat and Robust
Fine-line routing
Build-in wettable flank feature
Accommodate FC/WB/SMT
One piece of metal ensures high reliability
SiP Module Assembling