Routable Lead Frame


This lead frame substrate is designed to support the SiP assembly where the thermal characteristic is essential. Further, due to the advantage of the PTH-free nature of the metal post terminal, this substrate enables a high current carrying feature that the conventional laminate substrate is difficult to achieve.


Key Benefits

  • No PTH

  • Flat and Robust

  • Fine-line routing

  • Build-in wettable flank feature

  • Accommodate FC/WB/SMT

  • One piece of metal ensures high reliability





SiP Module Assembling