This lead frame substrate is designed to support the SiP assembly where the thermal characteristic is essential. Further, due to the advantage of the PTH-free nature of the metal post terminal, this substrate enables a high current carrying feature that the conventional laminate substrate is difficult to achieve.

Key Benefits

• No PTH

• Flat and Robust

• Fine-line routing

• Build-in wettable flank feature

• Accommodate FC/WB/SMT

• One piece of metal ensures high reliability

APPLICATION

SiP Module Assembling

GENERAL GUIDELINES