Routing flexibility enables a high degree of freedom in module design
Integral copper base structure ensures optimal thermal performance
Lower chip operation temperature and PTH-free offer high package-level reliability
The highest possible thermal performance for resin-based module
Flexible routing enables a high degree of freedom in module design
- Highest thermal and reliability among all plastic BGA and modules
- Best cost/performance
- Engine Control Unit
- Transmission Control Unit
- Sensing / Monitoring
- RF communication