This lead frame substrate is designed to support the SiP assembly where the thermal characteristic is essential. Further, due to the advantage of the PTH-free nature of the metal post terminal, this substrate enables a high current carrying feature that the conventional laminate substrate is difficult to achieve.

Key Benefits

• Mechanically robust and high reliability

• Adopt Lead Frame/PCB manufacturing infrastructures

• Facilitate multi-chip, higher pin-count, and passive integration

APPLICATION

GENERAL GUIDELINES