This lead frame substrate is designed to support the SiP assembly with superior thermal performance. Further, due to the PTH-free nature of the metal plate, the routing leads enable the lower total device resistance RDS(on), higher power density, and high-frequency switching features than that of the conventional laminate substrate.
Mechanically robust and high reliability
Adopt Lead Frame/PCB manufacturing infrastructures
Facilitate multi-chip, higher pin-count, passive integration, as well as flexibility for power and ground placement