Routable Lead Frame


This lead frame substrate is designed to support the SiP assembly where the thermal characteristic is essential. Further, due to the advantage of the PTH-free nature of the metal post terminal, this substrate enables a high current carrying feature that the conventional laminate substrate is difficult to achieve.

 


Key Benefits

 

  • Mechanically robust and high reliability

  • Adopt Lead Frame/PCB manufacturing infrastructures

  • Facilitate multi-chip, higher pin-count, and passive integration

 

       

 

                

 


APPLICATION

 


GENERAL GUIDELINES

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