U.S. Patent Portfolio

	PAT. NO.	Title
1	10,804,205	Interconnect substrate with stiffener and warp balancer and semiconductor assembly using the same
2	10,546,808	Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assembly
3	10,446,526	Face-to-face semiconductor assembly having semiconductor device in dielectric recess
4	10,420,204	Wiring board having electrical isolator and moisture inhibiting cap incorporated therein and method of making the same
5	10,361,151	Wiring board having isolator and bridging element and method of making wiring board
6	10,354,984	Semiconductor assembly with electromagnetic shielding and thermally enhanced characteristics and method of making the same
7	10,306,777	Wiring board with dual stiffeners and dual routing circuitries integrated together and method of making the same
8	10,269,722	Wiring board having component integrated with leadframe and method of making the same
9	10,242,964	Wiring substrate for stackable semiconductor assembly and stackable semiconductor assembly using the same
10	10,217,710	Wiring board with embedded component and integrated stiffener, method of making the same and face-to-face semiconductor assembly using the same
11	10,211,067	Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assembly
12	10,199,321	Interconnect substrate having cavity for stackable semiconductor assembly, manufacturing method thereof and vertically stacked semiconductor assembly using the same
13	10,177,130	Semiconductor assembly having anti-warping controller and vertical connecting element in stiffener
14	10,177,090	Package-on-package semiconductor assembly having bottom device confined by dielectric recess
15	10,134,711	Thermally enhanced semiconductor assembly with three dimensional integration and method of making the same
16	10,121,768	Thermally enhanced face-to-face semiconductor assembly with built-in heat spreader and method of making the same
17	10,096,573	Face-to-face semiconductor assembly having semiconductor device in dielectric recess
18	10,062,663	Semiconductor assembly with built-in stiffener and integrated dual routing circuitries and method of making the same
19	9,947,625	Wiring board with embedded component and integrated stiffener and method of making the same
20	9,913,385	Methods of making stackable wiring board having electronic component in dielectric recess
21	9,825,009	Interconnect substrate having cavity for stackable semiconductor assembly, manufacturing method thereof and vertically stacked semiconductor assembly using the same
22	9,640,518	Semiconductor package with package-on-package stacking capability and method of manufacturing the same
23	9,570,372	Thermally enhanced semiconductor assembly with heat spreader and integrated dual build-up circuitries and method of making the same
24	9,349,711	Semiconductor device with face-to-face chips on interposer and method of manufacturing the same
25	9,299,651	Semiconductor assembly and method of manufacturing the same
26	9,230,901	Semiconductor device having chip embedded in heat spreader and electrically connected to interposer and method of manufacturing the same
27	9,209,154	Semiconductor package with package-on-package stacking capability and method of manufacturing the same
28	9,147,667	Semiconductor device with face-to-face chips on interposer and method of manufacturing the same
29	9,147,587	Interconnect substrate with embedded semiconductor device and built-in stopper and method of making the same
30	9,087,847	Thermally enhanced interconnect substrate with embedded semiconductor device and built-in stopper and method of making the same
31	9,064,878	Wiring board with shielding lid and shielding slots as electromagnetic shields for embedded device
32	9,018,667	Semiconductor chip assembly with post/base heat spreader and dual adhesives
33	8,952,526	Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
34	8,927,339	Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry
35	8,901,435	Hybrid wiring board with built-in stopper, interposer and build-up circuitry
36	8,895,380	Method of making semiconductor assembly with built-in stiffener and semiconductor assembly manufactured thereby
37	8,865,525	Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby
38	8,841,171	Method of making stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
39	8,614,502	Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic device
40	8,535,985	Method of making a semiconductor chip assembly with a bump/base heat spreader and an inverted cavity in the bump
41	8,531,024	Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace
42	8,525,214	Semiconductor chip assembly with post/base heat spreader with thermal via
43	8,415,703	Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange
44	8,378,372	Semiconductor chip assembly with post/base heat spreader and horizontal signal routing
45	8,354,688	Semiconductor chip assembly with bump/base/ledge heat spreader, dual adhesives and cavity in bump
46	8,354,283	Method of making a semiconductor chip assembly with a bump/base/ledge heat spreader, dual adhesives and a cavity in the bump
47	8,343,808	Method of making stackable semiconductor assembly with bump/base/flange heat spreader and build-up circuitry
48	8,329,510	Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer
49	8,324,723	Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump
50	8,324,653	Semiconductor chip assembly with ceramic/metal substrate

51	8,314,438	Semiconductor chip assembly with bump/base heat spreader and cavity in bump
52	8,310,043	Semiconductor chip assembly with post/base heat spreader with ESD protection layer
53	8,304,292	Method of making a semiconductor chip assembly with a ceramic/metal substrate
54	8,298,868	Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-hole
55	8,288,792	Semiconductor chip assembly with post/base/post heat spreader
56	8,283,211	Method of making a semiconductor chip assembly with a bump/base heat spreader and a dual-angle cavity in the bump
57	8,269,336	Semiconductor chip assembly with post/base heat spreader and signal post
58	8,241,962	Method of making a semiconductor chip assembly with a post/base heat spreader, a signal post and a cavity
59	8,236,619	Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace
60	8,236,618	Method of making a semiconductor chip assembly with a post/base/post heat spreader
61	8,232,576	Semiconductor chip assembly with post/base heat spreader and ceramic block in post
62	8,232,573	Semiconductor chip assembly with aluminum post/base heat spreader and silver/copper conductive trace
63	8,227,270	Method of making a semiconductor chip assembly with a post/base heat spreader and an adhesive between the base and a terminal
64	8,212,279	Semiconductor chip assembly with post/base heat spreader, signal post and cavity
65	8,207,553	Semiconductor chip assembly with base heat spreader and cavity in base
66	8,207,019	Method of making a semiconductor chip assembly with a post/base/post heat spreader and asymmetric posts
67	8,203,167	Semiconductor chip assembly with post/base heat spreader and adhesive between base and terminal
68	8,193,556	Semiconductor chip assembly with post/base heat spreader and cavity in post
69	8,178,395	Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal via
70	8,163,603	Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding
71	8,153,477	Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader
72	8,148,747	Semiconductor chip assembly with post/base/cap heat spreader
73	8,148,207	Method of making a semiconductor chip assembly with a post/base/cap heat spreader
74	8,129,742	Semiconductor chip assembly with post/base heat spreader and plated through-hole
75	8,110,446	Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace
76	8,076,182	Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post
77	8,067,784	Semiconductor chip assembly with post/base heat spreader and substrate
78	8,067,270	Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate
79	8,062,912	Method of making a semiconductor chip assembly with a post/base heat spreader and horizontal signal routing
80	8,034,645	Method of making a semiconductor chip assembly with a copper/aluminum post/base heat spreader
81	8,003,416	Method of making a semiconductor chip assembly with a post/base heat spreader and dual adhesives
82	8,003,415	Method of making a semiconductor chip assembly with a post/base heat spreader and vertical signal routing
83	7,993,983	Method of making a semiconductor chip assembly with chip and encapsulant grinding
84	7,951,622	Method of making a semiconductor chip assembly with a post/base heat spreader and a signal post
85	7,948,076	Semiconductor chip assembly with post/base heat spreader and vertical signal routing
86	7,939,375	Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post
87	7,932,165	Method of making a semiconductor chip assembly with a laterally aligned filler and insulative base
88	7,901,993	Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive trace
89	7,833,827	Method of making a semiconductor chip assembly with a bumped terminal, a filler and an insulative base
90	7,811,863	Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachment
91	7,750,483	Semiconductor chip assembly with welded metal pillar and enlarged plated contact terminal
92	7,656,031	Stackable semiconductor package having metal pin within through hole of package
93	7,538,415	Semiconductor chip assembly with bumped terminal, filler and insulative base
94	7,494,843	Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding
95	7,459,385	Method of making a semiconductor chip assembly with a laterally aligned bumped terminal and filler
96	7,453,140	Semiconductor chip assembly with laterally aligned filler and insulative base
97	7,446,419	Semiconductor chip assembly with welded metal pillar of stacked metal balls
98	7,425,759	Semiconductor chip assembly with bumped terminal and filler
99	7,419,851	Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal
100	7,417,314	Semiconductor chip assembly with laterally aligned bumped terminal and filler

101	7,414,319	Semiconductor chip assembly with metal containment wall and solder terminal
102	7,396,703	Method of making a semiconductor chip assembly with a bumped terminal and a filler
103	7,319,265	Semiconductor chip assembly with precision-formed metal pillar
104	7,268,421	Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond
105	7,264,991	Method of connecting a conductive trace to a semiconductor chip using conductive adhesive
106	7,262,082	Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture
107	7,245,023	Semiconductor chip assembly with solder-attached ground plane
108	7,232,707	Method of making a semiconductor chip assembly with an interlocked contact terminal
109	7,232,706	Method of making a semiconductor chip assembly with a precision-formed metal pillar
110	7,229,853	Method of making a semiconductor chip assembly using multiple etch steps to form a pillar after forming a routing line
111	7,227,249	Three-dimensional stacked semiconductor package with chips on opposite sides of lead
112	7,215,019	Semiconductor chip assembly with pillar press-fit into ground plane
113	7,192,803	Method of making a semiconductor chip assembly with simultaneously formed interconnect and connection joint
114	7,190,080	Semiconductor chip assembly with embedded metal pillar
115	7,190,060	Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same
116	7,157,791	Semiconductor chip assembly with press-fit ground plane
117	7,148,082	Method of making a semiconductor chip assembly with a press-fit ground plane
118	7,132,741	Semiconductor chip assembly with carved bumped terminal
119	7,129,575	Semiconductor chip assembly with bumped metal pillar
120	7,129,113	Method of making a three-dimensional stacked semiconductor package with a metal pillar in an encapsulant aperture
121	7,112,521	Method of making a semiconductor chip assembly with a bumped metal pillar
122	7,094,676	Semiconductor chip assembly with embedded metal pillar
123	7,087,466	Method of making a semiconductor chip assembly with a solder-attached ground plane
124	7,075,186	Semiconductor chip assembly with interlocked contact terminal
125	7,071,573	Semiconductor chip assembly with welded metal pillar
126	7,071,089	Method of making a semiconductor chip assembly with a carved bumped terminal
127	7,067,911	Three-dimensional stacked semiconductor package with metal pillar in encapsulant aperture
128	7,064,012	Method of making a semiconductor chip assembly with a pillar and a routing line using multiple etch steps
129	7,015,128	Method of making a semiconductor chip assembly with an embedded metal particle
130	7,009,309	Semiconductor package device that includes an insulative housing with a protruding peripheral portion
131	7,009,297	Semiconductor chip assembly with embedded metal particle
132	6,989,584	Semiconductor package device that includes a conductive trace with a routing line, a terminal and a lead
133	6,989,295	Method of making a semiconductor package device that includes an insulative housing with first and second housing portions
134	6,987,034	Method of making a semiconductor package device that includes singulating and trimming a lead
135	6,984,576	Method of connecting an additively and subtractively formed conductive trace and an insulative base to a semiconductor chip
136	6,949,408	Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps
137	6,936,495	Method of making an optoelectronic semiconductor package device
138	6,908,794	Method of making a semiconductor package device that includes a conductive trace with recessed and non-recessed portions
139	6,908,788	Method of connecting a conductive trace to a semiconductor chip using a metal base
140	6,891,276	Semiconductor package device
141	6,876,072	Semiconductor chip assembly with chip in substrate cavity
142	6,872,591	Method of making a semiconductor chip assembly with a conductive trace and a substrate
143	6,846,735	Compliant test probe with jagged contact surface
144	6,809,414	Semiconductor chip assembly with bumped conductive trace
145	6,803,651	Optoelectronic semiconductor package device
146	6,800,506	Method of making a bumped terminal in a laminated structure for a semiconductor chip assembly
147	6,794,741	Three-dimensional stacked semiconductor package with pillars in pillar cavities
148	6,774,659	Method of testing a semiconductor package device
149	6,744,126	Multichip semiconductor package device
150	6,740,576	Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly

151	6,716,670	Method of forming a three-dimensional stacked semiconductor package device
152	6,699,780	Method of connecting a conductive trace to a semiconductor chip using plasma undercut etching
153	6,673,710	Method of connecting a conductive trace and an insulative base to a semiconductor chip
154	6,667,229	Method of connecting a bumped compliant conductive trace and an insulative base to a semiconductor chip
155	6,608,374	Semiconductor chip assembly with bumped conductive trace
156	6,593,224	Method of manufacturing a multilayer interconnect substrate
157	6,583,040	Method of making a pillar in a laminated structure for a semiconductor chip assembly
158	6,576,493	Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps
159	6,537,851	Method of connecting a bumped compliant conductive trace to a semiconductor chip
160	6,492,252	Method of connecting a bumped conductive trace to a semiconductor chip
161	6,486,549	Semiconductor module with encapsulant base