Multi buildup layers disposed on lead frame allows for a chip last FanOut-like package with QFN format.

 

SCHEMATIC ASSEMBLY

 

 

KEY FEATURES

  • Large panel manufacturing on metal carrier

  • Truly chip-last assembly without de-panel process

  • No extra substrate needed

  • Designed for the integration of microprocessor, sensors, RF, automotive, and power devices

 

LAYOUT GUIDELINES

 

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