PAT. NO. Title 1 10,804,205 Interconnect substrate with stiffener and warp balancer and semiconductor assembly using the same 2 10,546,808 Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assembly 3 10,446,526 Face-to-face semiconductor assembly having semiconductor device in dielectric recess 4 10,420,204 Wiring board having electrical isolator and moisture inhibiting cap incorporated therein and method of making the same 5 10,361,151 Wiring board having isolator and bridging element and method of making wiring board 6 10,354,984 Semiconductor assembly with electromagnetic shielding and thermally enhanced characteristics and method of making the same 7 10,306,777 Wiring board with dual stiffeners and dual routing circuitries integrated together and method of making the same 8 10,269,722 Wiring board having component integrated with leadframe and method of making the same 9 10,242,964 Wiring substrate for stackable semiconductor assembly and stackable semiconductor assembly using the same 10 10,217,710 Wiring board with embedded component and integrated stiffener, method of making the same and face-to-face semiconductor assembly using the same 11 10,211,067 Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assembly 12 10,199,321 Interconnect substrate having cavity for stackable semiconductor assembly, manufacturing method thereof and vertically stacked semiconductor assembly using the same 13 10,177,130 Semiconductor assembly having anti-warping controller and vertical connecting element in stiffener 14 10,177,090 Package-on-package semiconductor assembly having bottom device confined by dielectric recess 15 10,134,711 Thermally enhanced semiconductor assembly with three dimensional integration and method of making the same 16 10,121,768 Thermally enhanced face-to-face semiconductor assembly with built-in heat spreader and method of making the same 17 10,096,573 Face-to-face semiconductor assembly having semiconductor device in dielectric recess 18 10,062,663 Semiconductor assembly with built-in stiffener and integrated dual routing circuitries and method of making the same 19 9,947,625 Wiring board with embedded component and integrated stiffener and method of making the same 20 9,913,385 Methods of making stackable wiring board having electronic component in dielectric recess 21 9,825,009 Interconnect substrate having cavity for stackable semiconductor assembly, manufacturing method thereof and vertically stacked semiconductor assembly using the same 22 9,640,518 Semiconductor package with package-on-package stacking capability and method of manufacturing the same 23 9,570,372 Thermally enhanced semiconductor assembly with heat spreader and integrated dual build-up circuitries and method of making the same 24 9,349,711 Semiconductor device with face-to-face chips on interposer and method of manufacturing the same 25 9,299,651 Semiconductor assembly and method of manufacturing the same 26 9,230,901 Semiconductor device having chip embedded in heat spreader and electrically connected to interposer and method of manufacturing the same 27 9,209,154 Semiconductor package with package-on-package stacking capability and method of manufacturing the same 28 9,147,667 Semiconductor device with face-to-face chips on interposer and method of manufacturing the same 29 9,147,587 Interconnect substrate with embedded semiconductor device and built-in stopper and method of making the same 30 9,087,847 Thermally enhanced interconnect substrate with embedded semiconductor device and built-in stopper and method of making the same 31 9,064,878 Wiring board with shielding lid and shielding slots as electromagnetic shields for embedded device 32 9,018,667 Semiconductor chip assembly with post/base heat spreader and dual adhesives 33 8,952,526 Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry 34 8,927,339 Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry 35 8,901,435 Hybrid wiring board with built-in stopper, interposer and build-up circuitry 36 8,895,380 Method of making semiconductor assembly with built-in stiffener and semiconductor assembly manufactured thereby 37 8,865,525 Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby 38 8,841,171 Method of making stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry 39 8,614,502 Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic device 40 8,535,985 Method of making a semiconductor chip assembly with a bump/base heat spreader and an inverted cavity in the bump 41 8,531,024 Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace 42 8,525,214 Semiconductor chip assembly with post/base heat spreader with thermal via 43 8,415,703 Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange 44 8,378,372 Semiconductor chip assembly with post/base heat spreader and horizontal signal routing 45 8,354,688 Semiconductor chip assembly with bump/base/ledge heat spreader, dual adhesives and cavity in bump 46 8,354,283 Method of making a semiconductor chip assembly with a bump/base/ledge heat spreader, dual adhesives and a cavity in the bump 47 8,343,808 Method of making stackable semiconductor assembly with bump/base/flange heat spreader and build-up circuitry 48 8,329,510 Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer 49 8,324,723 Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump 50 8,324,653 Semiconductor chip assembly with ceramic/metal substrate 51 8,314,438 Semiconductor chip assembly with bump/base heat spreader and cavity in bump 52 8,310,043 Semiconductor chip assembly with post/base heat spreader with ESD protection layer 53 8,304,292 Method of making a semiconductor chip assembly with a ceramic/metal substrate 54 8,298,868 Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-hole 55 8,288,792 Semiconductor chip assembly with post/base/post heat spreader 56 8,283,211 Method of making a semiconductor chip assembly with a bump/base heat spreader and a dual-angle cavity in the bump 57 8,269,336 Semiconductor chip assembly with post/base heat spreader and signal post 58 8,241,962 Method of making a semiconductor chip assembly with a post/base heat spreader, a signal post and a cavity 59 8,236,619 Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace 60 8,236,618 Method of making a semiconductor chip assembly with a post/base/post heat spreader 61 8,232,576 Semiconductor chip assembly with post/base heat spreader and ceramic block in post 62 8,232,573 Semiconductor chip assembly with aluminum post/base heat spreader and silver/copper conductive trace 63 8,227,270 Method of making a semiconductor chip assembly with a post/base heat spreader and an adhesive between the base and a terminal 64 8,212,279 Semiconductor chip assembly with post/base heat spreader, signal post and cavity 65 8,207,553 Semiconductor chip assembly with base heat spreader and cavity in base 66 8,207,019 Method of making a semiconductor chip assembly with a post/base/post heat spreader and asymmetric posts 67 8,203,167 Semiconductor chip assembly with post/base heat spreader and adhesive between base and terminal 68 8,193,556 Semiconductor chip assembly with post/base heat spreader and cavity in post 69 8,178,395 Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal via 70 8,163,603 Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding 71 8,153,477 Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader 72 8,148,747 Semiconductor chip assembly with post/base/cap heat spreader 73 8,148,207 Method of making a semiconductor chip assembly with a post/base/cap heat spreader 74 8,129,742 Semiconductor chip assembly with post/base heat spreader and plated through-hole 75 8,110,446 Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace 76 8,076,182 Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post 77 8,067,784 Semiconductor chip assembly with post/base heat spreader and substrate 78 8,067,270 Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate 79 8,062,912 Method of making a semiconductor chip assembly with a post/base heat spreader and horizontal signal routing 80 8,034,645 Method of making a semiconductor chip assembly with a copper/aluminum post/base heat spreader 81 8,003,416 Method of making a semiconductor chip assembly with a post/base heat spreader and dual adhesives 82 8,003,415 Method of making a semiconductor chip assembly with a post/base heat spreader and vertical signal routing 83 7,993,983 Method of making a semiconductor chip assembly with chip and encapsulant grinding 84 7,951,622 Method of making a semiconductor chip assembly with a post/base heat spreader and a signal post 85 7,948,076 Semiconductor chip assembly with post/base heat spreader and vertical signal routing 86 7,939,375 Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post 87 7,932,165 Method of making a semiconductor chip assembly with a laterally aligned filler and insulative base 88 7,901,993 Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive trace 89 7,833,827 Method of making a semiconductor chip assembly with a bumped terminal, a filler and an insulative base 90 7,811,863 Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachment 91 7,750,483 Semiconductor chip assembly with welded metal pillar and enlarged plated contact terminal 92 7,656,031 Stackable semiconductor package having metal pin within through hole of package 93 7,538,415 Semiconductor chip assembly with bumped terminal, filler and insulative base 94 7,494,843 Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding 95 7,459,385 Method of making a semiconductor chip assembly with a laterally aligned bumped terminal and filler 96 7,453,140 Semiconductor chip assembly with laterally aligned filler and insulative base 97 7,446,419 Semiconductor chip assembly with welded metal pillar of stacked metal balls 98 7,425,759 Semiconductor chip assembly with bumped terminal and filler 99 7,419,851 Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal 100 7,417,314 Semiconductor chip assembly with laterally aligned bumped terminal and filler 101 7,414,319 Semiconductor chip assembly with metal containment wall and solder terminal 102 7,396,703 Method of making a semiconductor chip assembly with a bumped terminal and a filler 103 7,319,265 Semiconductor chip assembly with precision-formed metal pillar 104 7,268,421 Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond 105 7,264,991 Method of connecting a conductive trace to a semiconductor chip using conductive adhesive 106 7,262,082 Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture 107 7,245,023 Semiconductor chip assembly with solder-attached ground plane 108 7,232,707 Method of making a semiconductor chip assembly with an interlocked contact terminal 109 7,232,706 Method of making a semiconductor chip assembly with a precision-formed metal pillar 110 7,229,853 Method of making a semiconductor chip assembly using multiple etch steps to form a pillar after forming a routing line 111 7,227,249 Three-dimensional stacked semiconductor package with chips on opposite sides of lead 112 7,215,019 Semiconductor chip assembly with pillar press-fit into ground plane 113 7,192,803 Method of making a semiconductor chip assembly with simultaneously formed interconnect and connection joint 114 7,190,080 Semiconductor chip assembly with embedded metal pillar 115 7,190,060 Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same 116 7,157,791 Semiconductor chip assembly with press-fit ground plane 117 7,148,082 Method of making a semiconductor chip assembly with a press-fit ground plane 118 7,132,741 Semiconductor chip assembly with carved bumped terminal 119 7,129,575 Semiconductor chip assembly with bumped metal pillar 120 7,129,113 Method of making a three-dimensional stacked semiconductor package with a metal pillar in an encapsulant aperture 121 7,112,521 Method of making a semiconductor chip assembly with a bumped metal pillar 122 7,094,676 Semiconductor chip assembly with embedded metal pillar 123 7,087,466 Method of making a semiconductor chip assembly with a solder-attached ground plane 124 7,075,186 Semiconductor chip assembly with interlocked contact terminal 125 7,071,573 Semiconductor chip assembly with welded metal pillar 126 7,071,089 Method of making a semiconductor chip assembly with a carved bumped terminal 127 7,067,911 Three-dimensional stacked semiconductor package with metal pillar in encapsulant aperture 128 7,064,012 Method of making a semiconductor chip assembly with a pillar and a routing line using multiple etch steps 129 7,015,128 Method of making a semiconductor chip assembly with an embedded metal particle 130 7,009,309 Semiconductor package device that includes an insulative housing with a protruding peripheral portion 131 7,009,297 Semiconductor chip assembly with embedded metal particle 132 6,989,584 Semiconductor package device that includes a conductive trace with a routing line, a terminal and a lead 133 6,989,295 Method of making a semiconductor package device that includes an insulative housing with first and second housing portions 134 6,987,034 Method of making a semiconductor package device that includes singulating and trimming a lead 135 6,984,576 Method of connecting an additively and subtractively formed conductive trace and an insulative base to a semiconductor chip 136 6,949,408 Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps 137 6,936,495 Method of making an optoelectronic semiconductor package device 138 6,908,794 Method of making a semiconductor package device that includes a conductive trace with recessed and non-recessed portions 139 6,908,788 Method of connecting a conductive trace to a semiconductor chip using a metal base 140 6,891,276 Semiconductor package device 141 6,876,072 Semiconductor chip assembly with chip in substrate cavity 142 6,872,591 Method of making a semiconductor chip assembly with a conductive trace and a substrate 143 6,846,735 Compliant test probe with jagged contact surface 144 6,809,414 Semiconductor chip assembly with bumped conductive trace 145 6,803,651 Optoelectronic semiconductor package device 146 6,800,506 Method of making a bumped terminal in a laminated structure for a semiconductor chip assembly 147 6,794,741 Three-dimensional stacked semiconductor package with pillars in pillar cavities 148 6,774,659 Method of testing a semiconductor package device 149 6,744,126 Multichip semiconductor package device 150 6,740,576 Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly 151 6,716,670 Method of forming a three-dimensional stacked semiconductor package device 152 6,699,780 Method of connecting a conductive trace to a semiconductor chip using plasma undercut etching 153 6,673,710 Method of connecting a conductive trace and an insulative base to a semiconductor chip 154 6,667,229 Method of connecting a bumped compliant conductive trace and an insulative base to a semiconductor chip 155 6,608,374 Semiconductor chip assembly with bumped conductive trace 156 6,593,224 Method of manufacturing a multilayer interconnect substrate 157 6,583,040 Method of making a pillar in a laminated structure for a semiconductor chip assembly 158 6,576,493 Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps 159 6,537,851 Method of connecting a bumped compliant conductive trace to a semiconductor chip 160 6,492,252 Method of connecting a bumped conductive trace to a semiconductor chip 161 6,486,549 Semiconductor module with encapsulant base 162 6,414,318 Electronic circuit 163 6,353,324 Electronic circuit 回上一頁